Please use this identifier to cite or link to this item: https://hdl.handle.net/10316/101301
Title: Influence of base pressure prior to deposition on the adhesion behaviour of carbon thin films on steel
Authors: Boeira, Carla D.
Leidens, Leonardo M.
Michels, Alexandre F.
Serra, Ricardo 
Evaristo, Manuel 
Fernandes, Filipe 
Cavaleiro, Albano 
Figueroa, Carlos A.
Keywords: Base pressure; Adhesion; DLC; Oxygen pressure; Delamination; Scratch test; EDS mapping
Issue Date: 2020
Project: UCS, INCT-INES (# 554336/2014- 0), CAPES to PROSUC (#88887.153304/2017-00) and PDSE (#88881.362240/2019-01) for financial support to C.D.B., CNPq ( #422372/2016-1 ), FAPERGS ( # 17/2551- 0001052-3 ) and Plasmar Tecnologia Ltda. (# 1408-25.51/14-6) for financial support 
CEMMPRE UIDB/00285/2020 [co-financed via FEDER and FCT (COMPETE)] and the EpipoléResearch Group 
Serial title, monograph or event: Applied Surface Science Advances
Volume: 2
Abstract: The poor adhesion of carbon thin films was the main restriction for its massive application in recent years. Physicochemical interaction improvement at the adhesion interface between substrate and thin film is one of the most important fields of research to overcome such problem. From a chemical point of view, oxygen seems to be a major issue in the adhesion control. In this work, the influence of base pressure prior to deposition process on the carbon thin film tribological behaviour was studied. Rockwell C and scratch tests were performed to qualify the thin film failures and adhesion. Chemical mapping was performed by energy-dispersive spectroscopy to characterise the chemical elements after thin film failure. The carbon thin films show better adhesion at lower base deposition pressures. The tribological behaviour is associated with the oxygen content in the chamber atmosphere as well as to the higher thin film adhesion achieved at lower base pressures.
URI: https://hdl.handle.net/10316/101301
ISSN: 26665239
DOI: 10.1016/j.apsadv.2020.100034
Rights: openAccess
Appears in Collections:I&D CEMMPRE - Artigos em Revistas Internacionais

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