Please use this identifier to cite or link to this item:
https://hdl.handle.net/10316/4191
Title: | Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications | Authors: | Schubert, Th. Trindade, B. Weißgärber, T. Kieback, B. |
Keywords: | Copper composites; Powder metallurgy; Thermal management; Heat sinks; Electronics | Issue Date: | 2008 | Citation: | Materials Science and Engineering: A. 475:1-2 (2008) 39-44 | Abstract: | Thermal aspects are becoming increasingly important for the reliability of the electronic components due to the continuous progress of the electronic industries. Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors. The ideal material working as heat sink and heat spreader should have a CTE of (4-8) × 10-6 K-1 and a high thermal conductivity. Metal matrix composites offer the possibility to tailor the properties of a metal by adding an appropriate reinforcement phase and to meet the demands in thermal management. | URI: | https://hdl.handle.net/10316/4191 | DOI: | 10.1016/j.msea.2006.12.146 | Rights: | openAccess |
Appears in Collections: | FCTUC Eng.Mecânica - Artigos em Revistas Internacionais |
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