Please use this identifier to cite or link to this item:
https://hdl.handle.net/10316/95584
DC Field | Value | Language |
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dc.contributor.author | Lopes, Pedro Alhais | - |
dc.contributor.author | Santos, Bruno C. | - |
dc.contributor.author | Almeida, Aníbal T. de | - |
dc.contributor.author | Tavakoli, Mahmoud | - |
dc.date.accessioned | 2021-08-09T10:32:06Z | - |
dc.date.available | 2021-08-09T10:32:06Z | - |
dc.date.issued | 2021-08-03 | - |
dc.identifier.issn | 2041-1723 | pt |
dc.identifier.uri | https://hdl.handle.net/10316/95584 | - |
dc.description.abstract | Integration of solid-state microchips into soft-matter, and stretchable printed electronics has been the biggest challenge against their scalable fabrication. We introduce, Pol-Gel, a simple technique for self-soldering, self-encapsulation, and self-healing, that allows low cost, scalable, and rapid fabrication of hybrid microchip-integrated ultra-stretchable circuits. After digitally printing the circuit, and placing the microchips, we trigger a Polymer-Gel transition in physically cross-linked block copolymers substrate, and silver liquid metal composite ink, by exposing the circuits to the solvent vapor. Once in the gel state, microchips penetrate to the ink and the substrate (Self-Soldering), and the ink penetrates to the substrate (Self-encapsulation). Maximum strain tolerance of ~1200% for printed stretchable traces, and >500% for chip-integrated soft circuits is achieved, which is 5x higher than the previous works. We demonstrate condensed soft-matter patches and e-textiles with integrated sensors, processors, and wireless communication, and repairing of a fully cut circuits through Pol-Gel. | pt |
dc.language.iso | eng | pt |
dc.publisher | Springer Nature | pt |
dc.relation | info:eu-repo/grantAgreement/FCT/9471 - RIDTI/PTDC/EEI-ROB/31784/2017/PT/Electronic Skin over Epidermis for wearable bio-monitoring | pt |
dc.relation | POCI-01-0247-FEDER-024533 | pt |
dc.rights | openAccess | pt |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | pt |
dc.title | Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing | pt |
dc.type | article | - |
degois.publication.firstPage | 4666 | pt |
degois.publication.issue | 1 | pt |
degois.publication.title | Nature Communications | pt |
dc.relation.publisherversion | https://doi.org/10.1038/s41467-021-25008-5 | pt |
dc.peerreviewed | yes | pt |
dc.identifier.doi | 10.1038/s41467-021-25008-5 | pt |
degois.publication.volume | 12 | pt |
dc.date.embargo | 2021-08-03 | * |
uc.date.periodoEmbargo | 0 | pt |
item.openairecristype | http://purl.org/coar/resource_type/c_18cf | - |
item.openairetype | article | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | open | - |
item.fulltext | Com Texto completo | - |
item.languageiso639-1 | en | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.orcid | 0000-0002-3641-5174 | - |
crisitem.author.orcid | 0000-0002-2590-2196 | - |
Appears in Collections: | I&D ISR - Artigos em Revistas Internacionais |
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File | Description | Size | Format | |
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s41467-021-25008-5.pdf | 7.75 MB | Adobe PDF | View/Open |
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