Please use this identifier to cite or link to this item:
https://hdl.handle.net/10316/111900
DC Field | Value | Language |
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dc.contributor.author | Reis Carneiro, Manuel | - |
dc.contributor.author | Almeida, Aníbal T. de | - |
dc.contributor.author | Tavakoli, Mahmoud | - |
dc.contributor.author | Majidi, Carmel | - |
dc.date.accessioned | 2024-01-16T10:41:31Z | - |
dc.date.available | 2024-01-16T10:41:31Z | - |
dc.date.issued | 2023-09 | - |
dc.identifier.issn | 2198-3844 | pt |
dc.identifier.issn | 2198-3844 | pt |
dc.identifier.uri | https://hdl.handle.net/10316/111900 | - |
dc.description.abstract | Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film circuitry composed of silver flakes and a water-based polyurethane dispersion. This ink uniquely combines high electrical conductivity (1.6 × 105 S m-1 ), high resolution digital printability, robust adhesion for microchip integration, mechanical resilience, and recyclability. Recycling is achieved with an ecologically-friendly processing method to decompose the circuits into constituent elements and recover the conductive ink with a decrease of only 2.4% in conductivity. Moreover, adding liquid metal enables stretchability of up to 200% strain, although this introduces the need for more complex recycling steps. Finally, on-skin electrophysiological monitoring biostickers along with a recyclable smart package with integrated sensors for monitoring safe storage of perishable foods are demonstrated. | pt |
dc.language.iso | eng | pt |
dc.publisher | Wiley-Blackwell | pt |
dc.relation | SFRH/BD/150691/2020 | pt |
dc.relation | European Commission through the European Research Council project Liquid3D | GA 101045072 | ERC-2021-COG | pt |
dc.relation | CMU-Portugal project WoW (45913), which had the support of the European Regional Development Fund (ERDF) and the Portuguese State through Portugal 2020 and COMPETE 2020 | pt |
dc.rights | openAccess | pt |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | pt |
dc.subject | direct ink writing | pt |
dc.subject | e-waste | pt |
dc.subject | flexible electronics | pt |
dc.subject | green electronics | pt |
dc.subject | microchip integration | pt |
dc.subject | printed electronics | pt |
dc.subject | recyclable electronics | pt |
dc.subject | smart packaging | pt |
dc.subject | soft circuits | pt |
dc.title | Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins | pt |
dc.type | article | - |
degois.publication.firstPage | e2301673 | pt |
degois.publication.issue | 26 | pt |
degois.publication.title | Advanced Science | pt |
dc.peerreviewed | yes | pt |
dc.identifier.doi | 10.1002/advs.202301673 | pt |
degois.publication.volume | 10 | pt |
dc.date.embargo | 2023-09-01 | * |
uc.date.periodoEmbargo | 0 | pt |
item.openairetype | article | - |
item.fulltext | Com Texto completo | - |
item.languageiso639-1 | en | - |
item.grantfulltext | open | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_18cf | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.orcid | 0000-0002-3641-5174 | - |
crisitem.author.orcid | 0000-0002-2590-2196 | - |
Appears in Collections: | I&D ISR - Artigos em Revistas Internacionais |
Files in This Item:
File | Description | Size | Format | |
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Advanced Science - 2023 - Reis Carneiro - Recyclable Thin‐Film Soft Electronics for Smart Packaging and E‐Skins.pdf | 4.1 MB | Adobe PDF | View/Open |
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This item is licensed under a Creative Commons License