Please use this identifier to cite or link to this item:
https://hdl.handle.net/10316/101654
DC Field | Value | Language |
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dc.contributor.author | Tavakoli, Mahmoud | - |
dc.contributor.author | Lopes, Pedro Alhais | - |
dc.contributor.author | Hajalilou, Abdollah | - |
dc.contributor.author | Silva, André F. | - |
dc.contributor.author | Carneiro, Manuel Reis | - |
dc.contributor.author | Carvalheiro, José | - |
dc.contributor.author | Pereira, João Marques | - |
dc.contributor.author | Almeida, Aníbal T. de | - |
dc.date.accessioned | 2022-09-06T13:40:04Z | - |
dc.date.available | 2022-09-06T13:40:04Z | - |
dc.date.issued | 2022-08 | - |
dc.identifier.issn | 0935-9648 | pt |
dc.identifier.issn | 1521-4095 | pt |
dc.identifier.uri | https://hdl.handle.net/10316/101654 | - |
dc.description.abstract | E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted "soldering" circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis. | pt |
dc.description.sponsorship | Investigação, financiada no âmbito dos projetos WoW do Programa Carnegie Mellon Portugal (CMU Portugal), Dermotronics e SMART Display. | pt |
dc.language.iso | eng | pt |
dc.publisher | Wiley | pt |
dc.relation | PTDC/EEIROB/31784/2017/Dermotronics | pt |
dc.relation | POCI-01-0247- FEDER-047153/SMART Display | pt |
dc.relation | CMU-Portugal project WoW/Reference 45913 | pt |
dc.rights | openAccess | pt |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | pt |
dc.subject | biphasic liquid metal | pt |
dc.subject | electronic waste | pt |
dc.subject | recyclable electronics | pt |
dc.subject | soft-matter electronics | pt |
dc.subject | wearable biomonitoring | pt |
dc.subject.mesh | Electrodes | pt |
dc.subject.mesh | Electronics | pt |
dc.subject.mesh | Humans | pt |
dc.subject.mesh | Metals | pt |
dc.subject.mesh | Polymers | pt |
dc.subject.mesh | Wearable Electronic Devices | pt |
dc.title | 3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics | pt |
dc.type | article | - |
degois.publication.firstPage | e2203266 | pt |
degois.publication.issue | 31 | pt |
degois.publication.title | Advanced Materials | pt |
dc.peerreviewed | yes | pt |
dc.identifier.doi | 10.1002/adma.202203266 | pt |
degois.publication.volume | 34 | pt |
dc.date.embargo | 2022-08-01 | * |
uc.date.periodoEmbargo | 0 | pt |
item.fulltext | Com Texto completo | - |
item.grantfulltext | open | - |
item.languageiso639-1 | en | - |
item.cerifentitytype | Publications | - |
item.openairetype | article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_18cf | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.researchunit | ISR - Institute of Systems and Robotics | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.parentresearchunit | University of Coimbra | - |
crisitem.author.orcid | 0000-0002-2590-2196 | - |
crisitem.author.orcid | 0000-0002-1291-2504 | - |
crisitem.author.orcid | 0000-0002-3641-5174 | - |
Appears in Collections: | I&D ISR - Artigos em Revistas Internacionais |
Files in This Item:
File | Description | Size | Format | |
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Advanced Materials - 2022 - Tavakoli - 3R Electronics Scalable Fabrication of Resilient Repairable and Recyclable.pdf | 3.62 MB | Adobe PDF | View/Open |
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