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Title: Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications
Authors: Schubert, Th. 
Trindade, B. 
Weißgärber, T. 
Kieback, B. 
Keywords: Copper composites; Powder metallurgy; Thermal management; Heat sinks; Electronics
Issue Date: 2008
Citation: Materials Science and Engineering: A. 475:1-2 (2008) 39-44
Abstract: Thermal aspects are becoming increasingly important for the reliability of the electronic components due to the continuous progress of the electronic industries. Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors. The ideal material working as heat sink and heat spreader should have a CTE of (4-8) × 10-6 K-1 and a high thermal conductivity. Metal matrix composites offer the possibility to tailor the properties of a metal by adding an appropriate reinforcement phase and to meet the demands in thermal management.
DOI: 10.1016/j.msea.2006.12.146
Rights: openAccess
Appears in Collections:FCTUC Eng.Mecânica - Artigos em Revistas Internacionais

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